A platinum-chip sensor in SMD design on a printed circuit board
Platinum sensors in SMD design are specially designed for automated assembly on printed circuit boards. Due to their small size they allow a high assembly density. The patented contact technology enables excellent processing results and high temperature cycle resistance.
The solder contacts are completely free of phosphorus, sulfur or other impurities. This is the prerequisite for excellent solder joints, as only in this way can very clean intermetallic phases form during soldering.
The sensors can be used at temperatures of up to 250 °C and can withstand soldering processes of over 300 °C without any problems. They can be processed by a variety of methods, such as:
Platinum chip temperature sensors are available in 3 designs types as standard. The types differ only in the design of the solder contacts. The PCS design has a contact on the reverse side (all-round contact), whereas the solder contact of the PCF design (flip chip) is on one side. In addition, there is a variant of this design (PCF-B) with a solderable, metallized rear side.
